Intel Memory | ST SiC | Exclusive with Greg Travis on Boeing
EE Times Current5 Huhti 2019

Intel Memory | ST SiC | Exclusive with Greg Travis on Boeing

Among the top stories this week: Intel’s new memory architecture; an exclusive interview with Greg Travis – a veteran software engineer and instrument-rated pilot. We ask him if Boeing 737 Max MCAS software can be fixed. We also look at STMicroelectronics’ strategic priority on silicon carbide; and how the risk-averse business mentality is making Japan’s car OEMs slow to embrace the global auto market’s shifting focus on mobility services.

Jaksot(260)

800Gs Finally Breaking Out and Benefits of Solution

800Gs Finally Breaking Out and Benefits of Solution

Join us for an in-depth discussion on the long-awaited breakthrough of 800G Ethernet technology and the crucial role of industry standards in driving its adoption. In this podcast, Synopsys Sr. Product Manager John Swanson will provide expert insights into the technical details of 800G Ethernet and how industry standards are enabling greater interoperability. In this episode, discover the benefits of 800G Ethernet, including its greater bandwidth, improved reliability, and how industry standards are enabling greater interoperability. Whether you're a chip designer or a curious listener, this podcast is your guide to the exciting new developments in networking and the future of data transmission. Synopsys.com

14 Huhti 202317min

"A Turning Point for AVs" - A Special Report

"A Turning Point for AVs" - A Special Report

Join us as we hear from Brett Brune, Editor-in-Chief of EET.com, and Gina Roos, Editor-in-Chief of ElectronicProducts.com, about the exciting developments this report covers and what it means for the future of AV technology.

4 Huhti 202312min

The Impact of UCIe on Multi-Die Systems

The Impact of UCIe on Multi-Die Systems

In this podcast episode with Manmeet Walia, we will explain the influence of UCIe, why it is the standard of choice over other interfaces, and how it helps designers overcome their die-to-die connectivity challenges for multi-die systems.

31 Maalis 202321min

Embedded World 2023 Recap

Embedded World 2023 Recap

The embedded world conference is back. We scour every corner of the NürnbergMesse to provide you with the latest trends and demos in key areas such as AI, IoT, autonomous systems, safety and security, SoC design, embedded vision, etc.

18 Maalis 202322min

Transforming Compute Possibilities with Multi-Die Systems

Transforming Compute Possibilities with Multi-Die Systems

Today we have Shekhar Kapoor, Sr. Director of Product Line Management at Synopsys. Shekhar outlines the industry’s shift to multi-die systems, challenges companies must consider, and how multi-die solutions can provide success in a competitive industry.

3 Maalis 202324min

Wide bandgap Semiconductors for EVs

Wide bandgap Semiconductors for EVs

Electric and hybrid electric vehicles are seeking efficient and cost-effective power conversion technologies. Wide bandgap semiconductors provide higher performance compared to silicon. In this special report with Filippo Di Giovanni, Strategic Marketing, Power Transistor sub-Group, STMicroelectronics, Maurizio Di Paolo Emilio will discuss the main challenges and which benefits GaN/SiC can offer to the automotive industry.

1 Maalis 202321min

Embedded Trends for a Connected World

Embedded Trends for a Connected World

Nitin Dahad, Editor-in-Chief of Embedded.com, presents a compilation of interviews on broad embedded trends, software portability for embedded IoT devices, and development for connected vehicle data platforms for this EE Times Current special report.

3 Helmi 202325min

The State of Analog Design in 2023

The State of Analog Design in 2023

Majeed Ahmad and Brett Brune preview some of what readers will discover in EETimes.com’s first-ever Analog Everywhere special report.

20 Tammi 202319min

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