Returning from Mars (Matt Damon Redux) | Apple & the Sun King | Chip Packaging
EE Times Current11 Loka 2019

Returning from Mars (Matt Damon Redux) | Apple & the Sun King | Chip Packaging

This week, packaging chips in the most advanced systems. There are no rules anymore and we’re going to sort it all out for you. Also, conducting business in the Trump Era. It’s beginning to look like the Court of the Sun King. And, there’s growing enthusiasm for going to Mars. We’ll be talking about getting there, which is one thing; but, we’ll also be talking about getting back, which is another thing altogether.

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Education Panel: How to Expand the Semiconductor Industry Talent Pool

Education Panel: How to Expand the Semiconductor Industry Talent Pool

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Why You Should Crush Your Beer Fridge and Other Appliances

Why You Should Crush Your Beer Fridge and Other Appliances

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A Distributor’s Role in Supporting Technologies at the Forefront of Power Electronics Megatrends

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Today we have Dr. Raphael Salmi, global president of Richardson RFPD, an Arrow Electronics Company. Richardson RFPD is a specialized electronic component distributor that differentiates itself by prov...

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AI at the Edge – Myth or Reality

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On the Weekly Briefing podcast: We talk with Renesas EVP Sailesh Chittepeddi, about the integration of Artificial Intelligence in IoT applications – also known as AioT and how a combination of AI and ...

11 Marras 202230min

An All Inclusive Journey to HPC/Data Center Silicon Success

An All Inclusive Journey to HPC/Data Center Silicon Success

Today’s feature interview is with Charlie Matar, a Senior Vice President of System Solutions & Ecosystem Enablement Group. We dive into the latest trends in HPC and data centers, the industry’s most s...

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Words to the Wise with Sally Ward-Foxton

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Joining us today is Sally Ward-Foxton, a reporter from EETimes.com and podcast host of AI with Sally. We celebrate EE Times' 50th Anniversary, highlight memorable stories and discuss her latest projec...

7 Loka 202222min

Improving PCB Structural Design and Reliability through Numerical Simulation

Improving PCB Structural Design and Reliability through Numerical Simulation

As PCB complexity increases, flexibility to design changes and higher predictability become the main challenges to meet today’s requirements from the market, mainly shorter time to market, lower costs...

23 Syys 202234min

Meet EETimes New Editor in Chief Brett Brune

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EETimes is excited to announce Brett Brune as its new Editor-in-Chief. We sit down with him to discuss his experience and the plans for the renowned publication.

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