This Year’s Model | Intel’s & Leti’s Trans-Atlantic Packaging | First Worm
EE Times Current6 Marras 2020

This Year’s Model | Intel’s & Leti’s Trans-Atlantic Packaging | First Worm

The Weekly Briefing podcast: It is almost impossible to create a modern product in a reasonable amount of time without models of hardware, or models of software, or – increasingly – models of both before anything is actually built or coded. How that works in practice is one of the marvels of modern engineering. A discussion with Altair SVP Pete Darnell. Also, Leti in France just began collaborating with Intel on advanced chip packaging. A discussion with EE Times newest contributor, Don Scansen.

Jaksot(260)

Suosittua kategoriassa Politiikka ja uutiset

aikalisa
rss-ootsa-kuullut-tasta
tervo-halme
ootsa-kuullut-tasta-2
politiikan-puskaradio
rss-podme-livebox
et-sa-noin-voi-sanoo-esittaa
viisupodi
otetaan-yhdet
rss-asiastudio
rss-vaalirankkurit-podcast
the-ulkopolitist
radio-antro
rss-mina-ukkola
io-techin-tekniikkapodcast
linda-maria
rikosmyytit
rss-kaikki-uusiksi
rss-hyvaa-huomenta-bryssel
rss-kuka-mina-olen