High-Speed Interconnects for AI & Physical AI with Samtec

What does it take to design interconnects for AI data centers pushing 112G, 224G, and even 448G? In this episode of the Altium OnTrack Podcast, host Zach Peterson sits down with Matt Burns, Director of Technical Marketing at Samtec, to unpack how connector technology has evolved to meet the demands of modern high-speed systems. From co-packaged copper and optics to near-package interconnects, Matt walks through Samtec's product families and explains why choosing your connector early in the design cycle is no longer optional at these speeds.

The conversation also explores how these same high-speed design principles are trickling down into embedded systems, where physical AI and edge computing are creating new demands for smaller, faster, denser interconnects. Matt shares insights from DesignCon, OFC, and Embedded World, painting a picture of an industry at an inflection point — one where robotics, AI accelerators, and open embedded standards are driving the next generation of connector innovation. Whether you're a PCB designer, systems architect, or just curious about what's happening at the bleeding edge of interconnect technology, this episode is packed with practical insight.

👉 Resources from this episode:

- More about Samtec: https://www.samtec.com/

- Connect with Matt: https://www.linkedin.com/in/matt-burns-samtec

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