A Modular Future: Chiplets, AI, and Advanced Packaging

A Modular Future: Chiplets, AI, and Advanced Packaging

Send us Fan Mail On this episode of Embedded Insiders, Ken sits down with Rozalia Beica, Field CTO at Rapidus Corporation, to explore the rise of chiplet integration, Rapidus' U.S. expansion, the transformative role of AI in semiconductors, and the growing importance of advanced packaging in the industry. Stay tuned for insights into how Rapidus is shaping the future of semiconductor technology. Next, Ken discusses how customer experience centers are driving innovation in complex embedded sys...

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Secure communications on the Internet of Things

Secure communications on the Internet of Things

Send us Fan Mail According to Louis Parks, President and CEO of of SecureRF, the company’s security protocols for the IoT are computationally much more intensive than other types of security that are ...

1 Juni 20163min

NXP FTF 2016: Is the hysteria around connected device security warranted?

NXP FTF 2016: Is the hysteria around connected device security warranted?

Send us Fan Mail There's been a media frenzy around security breaches such as the Jeep hack, pacemaker's being compromised, and insulin pumps being commandeered, but is it really warranted? In all of ...

27 Maj 201613min

NXP FTF 2016: Eliminating tradeoffs of Java versus C in embedded, IoT

NXP FTF 2016: Eliminating tradeoffs of Java versus C in embedded, IoT

Send us Fan Mail With the integration of IT and OT on the Internet of Things, Java is becoming more relevant to embedded development. However, traditional bottlenecks still persist with Java. In this ...

27 Maj 20167min

NXP FTF 2016: Security, criticality, and connected healthcare with QNX

NXP FTF 2016: Security, criticality, and connected healthcare with QNX

Send us Fan Mail In no other industry is the impact of connected device/system security more important than healthcare. The requirements for connected medical devices, and the data they transmit and s...

26 Maj 20164min

NXP FTF 2016: The why and how of intelligent sensors at the edge

NXP FTF 2016: The why and how of intelligent sensors at the edge

Send us Fan Mail Sensors are complex, which is why so few companies are really developing them. For the past few years, however, Ian Chen, formerly of Freescale's Sensor Business Unit and now the Dire...

26 Maj 20165min

NXP FTF 2016: Security lifecycle management for IoT edge devices

NXP FTF 2016: Security lifecycle management for IoT edge devices

Send us Fan Mail At NXP's FTF 2016, Embedded Computing Design Technology Editor Brandon Lewis met with Gowri Chindalore, Head of Technology & Business Strategy at NXP Semiconductor. During the convers...

26 Maj 20163min

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