CES 2019 Special: Paul Loughnane, TE Connectivity
EE Times Current14 Jan 2019

CES 2019 Special: Paul Loughnane, TE Connectivity

EETimes On Air host David Finch interviews Paul Loughnane, CTO and VP of Engineering for Appliances at TE Connectivity.

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Qualcomm’s AI Chip | V2X Debate | Countdown to China’s IC Self-Sufficiency

Qualcomm’s AI Chip | V2X Debate | Countdown to China’s IC Self-Sufficiency

Today is Friday, April 12th, and among the top stories this week - Qualcomm’s new data-center AI inference accelerator chip, the latest deep learning developments unveiled at a Stanford University gat...

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Intel Memory | ST SiC | Exclusive with Greg Travis on Boeing

Intel Memory | ST SiC | Exclusive with Greg Travis on Boeing

Among the top stories this week: Intel’s new memory architecture; an exclusive interview with Greg Travis – a veteran software engineer and instrument-rated pilot. We ask him if Boeing 737 Max MCAS so...

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Nvidia buys Mellanox | Facebook snatches up Sonics | Geneva Auto Show

Nvidia buys Mellanox | Facebook snatches up Sonics | Geneva Auto Show

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This is your EETimes Weekly Briefing. Today is Friday, March 8th, and these are the top stories this week. Dylan McGrath was in San Francisco this week to cover RSA Conference. Here’s Dylan summary of...

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This is your EETimes Weekly Briefing. Today is Friday, March 1st, and these are the week's top stories. It's been a busy week with two major shows unfolding at the same time: Embedded World in Nurembe...

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TSMC Scraps a Batch of Wafers | AI Limitations | ISSCC

TSMC Scraps a Batch of Wafers | AI Limitations | ISSCC

This is your EETimes Weekly Briefing. Today is Friday, February 22nd, and these are the week's top stories.

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Launch of RISC-V Special Project | MIPS vs. RISC-V | RISC-V Impact on ARM

This is your EETimes weekly briefing and these are the top stories from the week of February 18th.

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