A Modular Future: Chiplets, AI, and Advanced Packaging
Embedded Insiders13 Feb 2025

A Modular Future: Chiplets, AI, and Advanced Packaging

Send us Fan Mail On this episode of Embedded Insiders, Ken sits down with Rozalia Beica, Field CTO at Rapidus Corporation, to explore the rise of chiplet integration, Rapidus' U.S. expansion, the transformative role of AI in semiconductors, and the growing importance of advanced packaging in the industry. Stay tuned for insights into how Rapidus is shaping the future of semiconductor technology. Next, Ken discusses how customer experience centers are driving innovation in complex embedded sys...

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NXP FTF 2016: The why and how of intelligent sensors at the edge

NXP FTF 2016: The why and how of intelligent sensors at the edge

Send us Fan Mail Sensors are complex, which is why so few companies are really developing them. For the past few years, however, Ian Chen, formerly of Freescale's Sensor Business Unit and now the Dire...

26 Mai 20165min

NXP FTF 2016: Security lifecycle management for IoT edge devices

NXP FTF 2016: Security lifecycle management for IoT edge devices

Send us Fan Mail At NXP's FTF 2016, Embedded Computing Design Technology Editor Brandon Lewis met with Gowri Chindalore, Head of Technology & Business Strategy at NXP Semiconductor. During the convers...

26 Mai 20163min

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