Automated Multiphysics for 3D IC Success

Automated Multiphysics for 3D IC Success

Challenges: power generates heat. Heat distorts wires and changes transistor behavior. A change in wires and transistors implies that initial power estimates were wrong.

More and more designers are moving to heterogeneous architectures. This comes with new challenges as compared to the 2D domain. Come learn how the Calibre team can help achieve successful 3D IC design goals.

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Avsnitt(272)

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Where Software Meets Silicon: A Digital Twin Playbook

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Do Spikes Need Common Language for Sensing and Learning?

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25 Aug 1h

Designing the AI Factory from the Rack Up

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Beyond Automation: Self-Verifying AI Agents for Semiconductor and PCB Design

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Can Great Sky’s Light-Connected AI Enable Bigger Brains?

Can Great Sky’s Light-Connected AI Enable Bigger Brains?

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22 Juli 58min

Under the Hood of Intelligent Systems

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Some of the most critical semiconductor innovation today sits beneath intelligent systems, where data moves, connects, and scales. As architectures become more distributed, sensor-rich, and AI-driven,...

27 Juni 32min

Will Photonics Loosen the Bottlenecks in Neural Systems?

Will Photonics Loosen the Bottlenecks in Neural Systems?

In this latest episode of Brains and Machines, Dr. Patty Stabile of the Eindhoven University of Technology chats with us about  her optical neural networks with ultra-low-latency processing, and the s...

8 Juni 46min

When AI Gets a Body: Physical AI, Humanoids and the Future of Silicon

When AI Gets a Body: Physical AI, Humanoids and the Future of Silicon

In this episode of EE Times Current, we’ll dive into Physical AI — from humanoids and embodied agents to the chips, sensors, and systems that let machines see, move, and interact with us. Guiding us t...

5 Juni 41min

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